TTEP 2023 - call for tutorial proposal

Overview

The Tutorials & Education Group (TEG) of the IEEE Computer Society Test Technology Technical Council (TTTC) organizes in 2023 a comprehensive set of Test Technology Tutorials to be held in conjunction with TTTC sponsored technical meetings. The objective of this common call is to invite submissions for tutorial proposals in order to enable selecting the best fitted tutorials for each technical meeting, as part of the annual Test Technology Educational Program (TTEP).

The tutorials accepted by the Program Committee will be included in the Test Technology Educational Program, the intent of which is to serve the test and design professionals offering fundamental education and expert knowledge in state-of-the-art test technology topics.

Participation in TTEP-organized tutorials is accredited by Test Technology Technical Council. Each full day tutorial corresponds to four TTEP units (half day tutorial corresponds to two TTEP units). Upon completion of every sixteen units official accreditation in the form of the “IEEE TTTC Test Technology Certificate” is presented to the participants.

The TTEP 2023 tutorials program includes (but is not limited to) the following technical meetings:

International Test Conference India (ITC-India’23)

International Test Conference Asia (ITC-Asia’23)

International Test Conference (ITC’23)

Asian Test Symposium (ATS’23)

Latin American Test Symposium (LATS’24)

TTEP accommodates a wide range of technical areas, from mature test topics of high interest to industrial test engineers to emerging test topics with emphasis on novelty. TTEP is soliciting new and updated tutorial proposals, as well as proposals for Test Clinics, which are particularly geared towards newcomers to the area of test, such as new test engineers and students pursuing graduate studies in test, with an objective of offering a broad yet comprehensive review of basic test topics in an accessible way to the lay audience. The topics of interest for year 2023 TTEP Tutorials include (but are not limited to):

3D chiplet testing
Artificial Intelligence for Test
Automatic test equipment
Board-level testing
Built-In Self-Test
Data analytics
Defect oriented testing
Design for testability
Diagnosis and debug
Embedded core testing
Failure analysis techniques

Functional safety
High-speed interface testing
Memory testing
Mixed-Signal/Analog testing
Nanometer technology testing
On-line and field testing
Performance/Delay testing
Microprocessor testing
Power issues in testing
Reliability and Automotive testing

Secure DfT
System-level testing
Test economics
Test resource partitioning
Test related standards
Testing machine learning engines
Verification and Validation
Wafer testing
Yield optimization and test

Submissions

All tutorial proposal submissions to TTEP 2023 are to be made electronically (in PDF format using the TTEP tutorial proposal template provided on both the TTEP main web site and the submission website) through the TTEP submissions website:

http://ttep.tttc-events.org/ttep/submission.html

Deadline for tutorials proposals

April 21st, 2023.